Non-contact method of cutting, drilling, scoring, and perforating these highly sensitive films
Thin films are used in a broad range of applications including electronics, solar panels, and packaging for food and medical use. Laser processing offers a non-contact method of cutting, drilling, scoring, and perforating these highly sensitive films while ensuring precise control of edge effects. It is also a sterile process, critical for ensuring health and safety of food and pharmaceutical packaging. Laser processing systems can be configured to meet exacting application requirements.
To ensure high accuracy and repeatability, lasers must have excellent power stability and beam quality. Pulsed or ultrafast lasers are often used to create crisp, clean edge results. Beam delivery may be in the form of an XY-gantry or scan head depending on application requirements but will require speed and high accuracy to ensure manufacturing needs are met.
Micron-level accuracy, high repeatability, and reliable solutions
Expand processing flexibility and improve productivity
High precision, high repeatability, and faster throughput solutions
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