Material Removal (Ablation)

Remove precise amounts of material to cause a change in texture, expose underlying surfaces or materials, remove contaminants and/or excess material

About Material Removal (Ablation)

Laser ablation removes precise amounts of material to cause a change in texture, expose underlying surfaces or materials, remove contaminants, or remove excess material. This non-contact method can be performed on 3D molded parts or delicate materials like foams or coated glass fibers without warping or damage. Laser ablation offers precise, repeatable depth control that removes only desired material without the use of chemicals or other consumables. Patterns are digitally controlled and can range from wide-area texturing to micron-sized areas around sensitive components.

 

The laser system used will depend on the material and the application (specifically its scale, quality, and throughput needs). Lasers may be CW, pulsed, or ultrafast depending on the type and amount of material to be removed. Scan heads or polygons may be used to deliver the required throughput speed, especially when multiple passes are required to achieve the desired ablation depth.

Material Removal (Ablation) Can Include:
  • Altering surface texture
  • Adding visual patterns
  • Wire or fiber stripping
  • Removing coatings or contaminants from substrates
  • Preparing surfaces for subsequent processes (adhesive bonding, painting, ceramic application)
  • Creating deeper, longer lasting marks in surfaces
  • Precise removal of excess material
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Application
Precision Processing

Micron-level accuracy, high repeatability, and reliable solutions

Application
Material Processing

High precision, high repeatability, and faster throughput solutions

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