Laser Ablation

Precise, repeatable depth control, removing material with extreme precision from user-selected areas

About Laser Ablation

Laser ablation is the removal of a layer of material while leaving the base material unaffected. This non-contact removal method can be used on slightly contoured surfaces or even extremely delicate materials with minimal to no damage to the substrate. Laser processing offers precise, repeatable depth control, removing material with extreme precision from user-selected target areas—all without masks, solvents, or other chemicals. Applications cover a wide range, including:

  • Wire, hairpin, or fiber stripping
  • Removal of paint, coatings, ink, or contaminants from substrates
  • Removal of excess adhesives from PCBs
  • Laser cleaning
  • Creating complex and/or flexible electronic circuits
  • Decorative embellishments
  • Material analysis (see Ablation for R&D)

A properly paired laser processing sub-system can be used on both flat and slightly contoured surfaces, removing the desired material in precise shapes and patterns as needed. Laser wavelength should be matched to the material being removed, ideally with minimal absorption into the underlying substrate to produce the fastest, highest quality ablation. Two or three axis scan heads are often used to provide high throughput speeds, especially if multiple passes are required to achieve the desired ablation depth and quality.

Industry
Converting, Packaging, & Labeling

Take your processing equipment to the next level

Industry
Manufacturing & Processing

Streamline processes with reliable technology

Application
Marking & Coding

High precision, high speed, and permanent non-contact solutions

Application
Material Processing

High precision, high repeatability, and faster throughput solutions

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