Laser Perforating for Material Processing

Create crisp, clean holes or dashes and control the size, depth, spacing, and placement

About Laser Perforating for Material Processing

Laser perforation yields crisp, clean holes or dashes and allows the user to control the size, depth, spacing, and placement of perforations to ensure proper appearance and function in finished goods. The results are extremely consistent and reliable since there is no tool wear. This digital, non-contact process enables design flexibility for a variety of applications, including:

  • Easy open/easy release
  • Folding
  • Separation
  • Increased breathability or ventilation
  • Aesthetic designs
  • Security and identification

Pulsed lasers can penetrate materials more efficiently, offering higher quality perforation holes at faster speeds. Scan heads offer high-speed, precise placement of holes when pattern flexibility (including on-the-fly changes) is required. Roll stock may also be moved at speed beneath a fixed-focus cut head if straight-line perforations are desired.

 
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Industry
Converting, Packaging, & Labeling

Take your processing equipment to the next level

Industry
Manufacturing & Processing

Streamline processes with reliable technology

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Application
Digital Converting

Expand processing flexibility and improve productivity

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Application
Material Processing

High precision, high repeatability, and faster throughput solutions