Measure semiconductors accurately, quickly, and at smaller scales
During production, the surface of semiconductor wafers are closely monitored for defects known as “features” that cause inconsistency in final product. As the wafers get smaller so do these features and following “Moores law”, the ability to measure them accurately, quickly and at smaller scales is becoming ever more important.
To measure these features quickly without contact, laser speckle is used. By looking at the interference pattern created when illuminated by long coherence lasers, the surface features can be resolved into 3 dimensions and to a high resolution. The key parameters for the successful use of speckle are high stability in the bandwidth and beam pointing. Any movement in either of these key parameters will result in false measurements, causing a good wafer to be rejected. For semiconductor wafer OEMs and system architects Novanta offers:
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