Drilling

Create precise, consistent holes with a non-contact process offering control of hole diameter, taper, depth, and placement with exceptional repeatability

About Laser Drilling

Laser drilling creates precise, consistent holes through a material. This non-contact process offers control of hole diameter, taper, depth, and placement with exceptional repeatability since there is no tool wear. Laser processing can also offer smaller feature sizes than traditional manufacturing methods, allowing it to become the manufacturing method of choice as devices become increasingly smaller and more complex.

 

Lasers used for these applications require high peak power to create high aspect ratio holes while minimizing heat impact. XY-gantries or scan heads may be used depending on the application, including material type, size of the drill area, and quality or throughput requirements. High accuracy will be required regardless to ensure proper placement of drill holes.

 
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Drilling Can Include:
  • Injection nozzles
  • Venting and cooling
  • PCBs and electronic wafers (VHD link)
  • Semiconductor probe cards (link)
  • Jewel bearings
  • Textile spinning nozzles
  • Ceramics
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Industry
Manufacturing & Processing

Streamline processes with reliable technology

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Application
Precision Processing

Micron-level accuracy, high repeatability, and reliable solutions

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Application
Material Processing

High precision, high repeatability, and faster throughput solutions