VERSIA New Hybrid Design, Compact Package

VERSIA is the next evolution in 2-axis laser scan head versatility and design

Faster, Easier OEM Integration With Broad Application Flexibility

Designed to accommodate UV, green, fiber, and CO2 laser wavelengths VERSIA offers OEMs and system integrators maximum laser processing flexibility. The enclosed, compact enclosure houses new proprietary analog and digital electronics, offering OEMs and system integrators the best value in performance and cost.

 

Inputs and outputs support industry standard XY2-100 interface with a single DB25 connector as well as Novanta’s NVL-100, two orientation options for the DB25 interface on laser input side or the top side make integration easier. Combine VERSIA with Novanta ScanMaster™ Controller and ScanMaster™ Designer Software to unlock industry leading features and take your laser processing to the next level.

VERSIA New Hybrid Design, Compact Package featured image
Innovations
Built for Versatility

Built with a compact, industrial design ideal for versatile applications including cutting, marking, coding, additive manufacturing, converting, material processing, and micromachining. Thanks to our new digital servo design, VERSIA can carry multiple tunes individually optimized for specific applications.


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Unleash Powerful Features & Tools

Combining VERSIA with Novanta ScanMaster™ Controller and ScanMaster™ Designer software opens the door to industry leading features that improve laser processing performance. Optimize laser system performance with bi-directional communication that enables scan head performance and job process monitoring, optimize job processing time and production throughput, and expand operational field size by synchronizing with an XY linear stage or multiple laser scan head configuration.


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Configurable VERSIA Scan Head & CO2 Laser Sub-Systems for OEMs

Save precious integration time and resources with proven, robust laser processing sub-system packages utilizing industry leading components from a single source. New laser processing sub-system packages include CO2 laser source, 2-axis scan head, controller, software, beam path protector, connector cables, and mounting hardware.


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